Ionic Migration Behavior In Minute Wiring
On Flexible Substrate
Author(s)
Y. Kimura, S. Isawa, M. Chino, H. Hara, K. Tamayama
& A. Suzuki
Abstract
Recently, miniaturization and high-density mounting have been demanded in
various electronic devices. Above all, flexible print circuit (FPC) technology has
been a focal point, especially in the field of notebook computers and cellular
phones, for obtaining a higher degree of freedom in design. In order to actualize
the fine pitch of wiring in FPC, the insulation degradation due to the migration
becomes a problem that cannot be ignored. Because of differences in its structure
and wiring from the former printed circuit board, the analysis of migration
behavior in FPC becomes important for evaluating the reliability of an electronic
component based on FPC. In this research, in order to grasp the migration
behavior of FPC, a 45µm pitched COF specimen was used. In addition, the
paragraphed 30µm pitch tooth profile wiring specimen was designated as the test
material. Then, a reliability test for evaluating the migration behavior was
conducted. As a result of a Steady-State Temperature Humidity Bias Life (THB)
test, the migration occurred progressively. Various investigations were
conducted for explaining about the mechanism of ionic migration. Also in this
paper, the adhesive strength between the polyimide film and copper (Cu) wiring
pattern, and that between the polyimide film and the under-filling material, was
measured in order to investigate the influence of the surface state of polyimide
film upon the migration behavior.
Keywords: ionic migration, FPC, reliability, THB testing.
Keywords
ionic migration, FPC, reliability, THB testing.
Related Book
Other papers in this volume
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