Parametric Simulation Of SiC Schottky JBS
Structures
Author(s)
T. Rang & R. Kurel
Abstract
The parametric simulation has been carried out for optimizing the influence of
the Schottky contact metal work function (contact surface interface) influence on
the distribution of the built-in electrical field and consequently on static and
dynamic characteristics of the JBS device. On the basis of simulations and
discussions the low-power losses solution for the JBS device has been
developed. The results suggest keeping the electric field strength under contact
surface as low as possible in order to reduce or even avoid the relatively
expensive and complex passivation solutions by the manufacturing of the JBS
devices.
The numerical simulator DYNAMIT 2DT-SCHOTTKY developed at the
Department of Electronics TUT was used in our research.
Keywords: SiC, JBS structures, contact metal work function, numerical
modelling.
1 Introduction
Silicon carbide (SiC) is an outstanding compound semiconductor material with
extremely promising physical properties that make it an excellent candidate in
high-speed and high-temperature power electronic applications. Metal
semiconductor interface is a fundamental aspect in any semiconductor device
technology. The research of different characteristics of Schottky contact involved
semiconductor structures is important. Furthermore, the 4H- and 6H- polytypes
of SiC have some remarkably different parameters, which have direct influence
on device characteristics.
The authors of this paper have studied devices with different Schottky
barriers for a long time. The changes in barrier heights strongly influence the
Keywords
SiC, JBS structures, contact metal work function, numerical
modelling.
Related Book
Other papers in this volume
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