BEM Modeling Of MEMS With Thin Plates
And Shells Using A Total Lagrangian Approach
Author(s)
S. Telukunta & S. Mukherjee
Abstract
Micro-Electro-Mechanical Systems (MEMS) typically consist of plate shaped conductors
that can be very thin - with h/L≈ O(10−2−10−3) (in terms of the thickness
h and length L of the side of a square pate). Conventional Boundary Element
Method (BEM) analysis of the electric field in a region exterior to these thin conductors
is difficult to carry out accurately and efficiently especially since MEMS
analysis requires computation of charge densities (and then surface tractions) separately
on the top and bottom surfaces of such thin plates. A new Boundary Integral
Equation (BIE) is derived in this work, and coupled with Finite Element Analysis
(FEM) to solve for the deformation of such thin MEMS structures. A fully
Lagrangian BEM formulation is developed here. A relaxation scheme is implemented
to solve for a self-consistent state of this coupled problem. Some sample
results are presented in this paper.
1 Introduction
The field of Micro-Electro-Mechanical Systems (MEMS) is a very broad one that
includes fixed ormovingmicrostructures; encompassing micro-electro-mechanical,
microfluidic, micro-opto-electro-mechanical and micro-thermo-mechanical
devices and systems. MEMS usually consists of released microstructures that are
suspended and anchored, or captured by a hub-cap structure and set into motion
by mechanical, electrical, thermal, acoustical or photonic energy source(s).
Typical MEMS structures consist of arrays of thin beams with cross-sections in
the order of microns (µm) and lengths in the order of ten to hundreds of microns.
Keywords
Related Book
Other papers in this volume
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